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M. Chemin
Publication Activity (10 Years)
Years Active: 2015-2015
Publications (10 Years): 0
Top Topics
Wire Bonding
Expert Systems
Power Distribution
Top Venues
Microelectron. Reliab.
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Publications
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William Sanfins
,
Damien Risaletto
,
Frédéric Richardeau
,
G. Blondel
,
M. Chemin
,
Philippe Baudesson
Preliminary failure-mode characterization of emerging direct-lead-bonding power module. Comparison with standard wire-bonding interconnection.
Microelectron. Reliab.
55 (9-10) (2015)