Ki Jin Han

Publication Activity (10 Years)

Years Active: 2008-2022
Publications (10 Years): 9

Top Topics

Medical Imaging

Induction Motor

Top Venues

IEEE Trans. Ind. Electron.

IEEE Veh. Technol. Mag.

Publications

Manje Yea, Jingook Kim, Ki Jin Han
Frequency-Dependent Bearing Voltage Model for Squirrel-Cage Induction Motors. IEEE Trans. Ind. Electron. 69 (5) (2022)
Jeong Tak Kim, Hyoil Kim, Ki Jin Han
Hyperloop Communications: Unveiling Electromagnetic Propagation in the Hyperloop Tube. IEEE Veh. Technol. Mag. 17 (3) (2022)
Sara Kaviani, Ki Jin Han, Insoo Sohn
Adversarial attacks and defenses on AI in medical imaging informatics: A survey. Expert Syst. Appl. 198 (2022)
Younggon Ryu, Manje Yea, Jingook Kim, Ki Jin Han
Stator Impedance Modeling Platform for the Electromagnetic Compatibility Aware Design of 3.7- to 7.5-KW Squirrel-Cage Induction Motors. IEEE Trans. Ind. Electron. 68 (11) (2021)
Byungjin Bae, Jingook Kim, Ki Jin Han
Numerical Verification of Dielectric Contactor as Auxiliary Loads for Measuring the Multi-Port Network Parameter of Vertical Interconnection Array. IEEE Access 8 (2020)
Seungwon Kim, Ki Jin Han, Youngmin Kim, Seokhyeong Kang
Power Integrity Coanalysis Methodology for Multi-Domain High-Speed Memory Systems. IEEE Access 7 (2019)
Seungwon Kim, Ki Jin Han, Youngmin Kim, Seokhyeong Kang
Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case study. DATE (2018)
Han-Joon Kim, Hiroshi Hirayama, Sanghoek Kim, Ki Jin Han, Rui Zhang, Ji-Woong Choi
Review of Near-Field Wireless Power and Communication for Biomedical Applications. IEEE Access 5 (2017)
Seungwon Kim, Seokhyeong Kang, Ki Jin Han, Youngmin Kim
Novel Adaptive Power-Gating Strategy and Tapered TSV Structure in Multilayer 3D IC. ACM Trans. Design Autom. Electr. Syst. 21 (3) (2016)
Seungwon Kim, Seokhyung Kang, Ki Jin Han, Youngmin Kim
Novel adaptive power gating strategy of TSV-based multi-layer 3D IC. ISQED (2015)
Ki Jin Han, Madhavan Swaminathan
Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 28 (6) (2009)
Ki Jin Han, Madhavan Swaminathan, Ege Engin
Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects. DAC (2008)