Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case study.
Seungwon KimKi Jin HanYoungmin KimSeokhyeong KangPublished in: DATE (2018)
Keyphrases
- high speed
- multi domain
- low power
- power dissipation
- cross domain
- search computing
- spoken dialogue systems
- memory subsystem
- domain specific
- power consumption
- real time
- computational power
- printed circuit boards
- ibm power processor
- gigabit ethernet
- multithreading
- neural network
- case study
- heterogeneous networks
- design methodology
- co occurrence
- real world
- content addressable memory