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Kewu Bai
Publication Activity (10 Years)
Years Active: 2013-2013
Publications (10 Years): 0
Top Topics
Wire Bonding
Particle Swarm Optimization
Real World
Experimental Study
Top Venues
Microelectron. Reliab.
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Publications
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Yingzhi Zeng
,
Kewu Bai
,
Hongmei Jin
Thermodynamic study on the corrosion mechanism of copper wire bonding.
Microelectron. Reliab.
53 (7) (2013)