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K. Suganuma
Publication Activity (10 Years)
Years Active: 2003-2012
Publications (10 Years): 0
Top Topics
Metadata
High Levels
Multiscale
Wireless Sensor Networks
Top Venues
Microelectron. Reliab.
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Publications
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K. Suganuma
,
S. Sakamoto
,
N. Kagami
,
D. Wakuda
,
K. S. Kim
,
M. Nogi
Low-temperature low-pressure die attach with hybrid silver particle paste.
Microelectron. Reliab.
52 (2) (2012)
M. Yamashita
,
K. Suganuma
Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure.
Microelectron. Reliab.
46 (7) (2006)
M. Yamashita
,
K. Suganuma
Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers.
Microelectron. Reliab.
46 (5-6) (2006)
K. S. Kim
,
S. H. Huh
,
K. Suganuma
Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu.
Microelectron. Reliab.
43 (2) (2003)