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D. Wakuda
Publication Activity (10 Years)
Years Active: 2012-2012
Publications (10 Years): 0
Top Topics
Metadata
High Levels
Multiscale
Wireless Sensor Networks
Top Venues
Microelectron. Reliab.
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Publications
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K. Suganuma
,
S. Sakamoto
,
N. Kagami
,
D. Wakuda
,
K. S. Kim
,
M. Nogi
Low-temperature low-pressure die attach with hybrid silver particle paste.
Microelectron. Reliab.
52 (2) (2012)