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James P. McEvoy
Publication Activity (10 Years)
Years Active: 2019-2019
Publications (10 Years): 1
Top Topics
Printed Circuit Boards
High Density
Real World
Top Venues
Digit. Investig.
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Publications
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Thibaut Heckmann
,
James P. McEvoy
,
Konstantinos Markantonakis
,
Raja Naeem Akram
,
David Naccache
Removing epoxy underfill between neighbouring components using acid for component chip-off.
Digit. Investig.
29 (2019)