Thibaut Heckmann

ORCID

Publication Activity (10 Years)

Years Active: 2016-2022
Publications (10 Years): 11

Top Venues

PSL Research University, Paris, France (PHD)

Education History

PSL Research University, Paris, France

PHD

Publications

Hadrien Barral, Georges-Axel Jaloyan, Fabien Thomas-Brans, Matthieu Regnery, Rémi Géraud-Stewart, Thibaut Heckmann, Thomas R. Souvignet, David Naccache
A forensic analysis of the Google Home: repairing compressed data without error correction. CoRR (2022)
Fabien Thomas-Brans, Thibaut Heckmann, Konstantinos Markantonakis, Damien Sauveron
New Diagnostic Forensic Protocol for Damaged Secure Digital Memory Cards. IEEE Access 10 (2022)
Thibaut Heckmann, Thomas R. Souvignet, Damien Sauveron, David Naccache
Medical Equipment Used for Forensic Data Extraction: A low-cost solution for forensic laboratories not provided with expensive diagnostic or advanced repair equipment. Digit. Investig. 36 (Supplement) (2021)
Carlton Shepherd, Konstantinos Markantonakis, Nico van Heijningen, Driss Aboulkassimi, Clément Gaine, Thibaut Heckmann, David Naccache
Physical fault injection and side-channel attacks on mobile devices: A comprehensive analysis. Comput. Secur. 111 (2021)
Carlton Shepherd, Konstantinos Markantonakis, Nico van Heijningen, Driss Aboulkassimi, Clément Gaine, Thibaut Heckmann, David Naccache
Physical Fault Injection and Side-Channel Attacks on Mobile Devices: A Comprehensive Survey. CoRR (2021)
Thomas R. Souvignet, Thibaut Heckmann, Timothy Bollé
From Lucky Luke to Lock Bits. IEEE Secur. Priv. 18 (2) (2020)
Thibaut Heckmann, Thomas R. Souvignet, David Naccache
Decrease of energy deposited during laser decapsulation attacks by dyeing and pigmenting the ECA: Application to the forensic micro-repair of wire bonding. Digit. Investig. 29 (2019)
Thibaut Heckmann, James P. McEvoy, Konstantinos Markantonakis, Raja Naeem Akram, David Naccache
Removing epoxy underfill between neighbouring components using acid for component chip-off. Digit. Investig. 29 (2019)
Thibaut Heckmann, Konstantinos Markantonakis, David Naccache, Thomas R. Souvignet
Forensic smartphone analysis using adhesives: Transplantation of Package on Package components. Digit. Investig. 26 (2018)
Thibaut Heckmann, Thomas R. Souvignet, David Naccache
Electrically conductive adhesives, thermally conductive adhesives and UV adhesives in data extraction forensics. Digit. Investig. 21 (2017)
Thibaut Heckmann, Thomas R. Souvignet, S. Lepeer, David Naccache
Low-temperature low-cost 58 Bismuth - 42 Tin alloy forensic chip re-balling and re-soldering. Digit. Investig. 19 (2016)

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Publication Activity (10 Years)

Top Topics

Top Venues

Thibaut Heckmann