Login / Signup
Huan Fei Wen
ORCID
Publication Activity (10 Years)
Years Active: 2023-2024
Publications (10 Years): 7
Top Topics
Motion Tracking
Nonrigid Shape
Imaging Technology
Volumetric Reconstruction
Top Venues
IEEE Trans. Instrum. Meas.
Sensors
</>
Publications
</>
Yankang Liu
,
Zhenhua Liu
,
Yang Li
,
Zongmin Ma
,
Zhonghao Li
,
Huan Fei Wen
,
Hao Guo
,
Jun Tang
,
Yan Jun Li
,
Jun Liu
The Fiber Self-Focusing Integrated Nitrogen Vacancy Magnetometer.
IEEE Trans. Instrum. Meas.
73 (2024)
Ziheng Gao
,
Huan Fei Wen
,
Xin Li
,
Wenyuan Hao
,
Ding Wang
,
Yanjie Liu
,
Zhong Hao Li
,
Hao Guo
,
Zongmin Ma
,
Jun Tang
,
Jun Liu
Three-Dimensional Inverse Reconstruction of Tiny Magnetic Structures by Quantum Technique.
IEEE Trans. Instrum. Meas.
73 (2024)
Wenyuan Hao
,
Yanjie Liu
,
Ziheng Gao
,
Ding Wang
,
Huan Fei Wen
,
Xin Li
,
Zhong Hao Li
,
Hao Guo
,
Zongmin Ma
,
Jun Tang
,
Jun Liu
Three-Dimensional Motion Tracking of High-Speed Magnetic Targets Using Microwave-Free Quantum Imaging Technology.
IEEE Trans. Instrum. Meas.
73 (2024)
Zhenrong Shi
,
Haodong Jin
,
Hao Zhang
,
Zhonghao Li
,
Huan Fei Wen
,
Hao Guo
,
Zongmin Ma
,
Jun Tang
,
Jun Liu
Measurements of Spatial Angles Using Diamond Nitrogen-Vacancy Center Optical Detection Magnetic Resonance.
Sensors
24 (8) (2024)
Wenyuan Hao
,
Huan Fei Wen
,
Ziheng Gao
,
Yanjie Liu
,
Ding Wang
,
Xin Li
,
Zhonghao Li
,
Hao Guo
,
Zongmin Ma
,
Jun Tang
,
Jun Liu
Traversal Window Inversion of 3-D Boundary of Micro Magnetic Target Based on Quantum Imaging Technique.
IEEE Trans. Instrum. Meas.
73 (2024)
Ding Wang
,
Huan Fei Wen
,
Xin Li
,
Yuchong Jin
,
Wenyuan Hao
,
Ziheng Gao
,
Yanjie Liu
,
Zhong Hao Li
,
Hao Guo
,
Zongmin Ma
,
Jun Tang
,
Jun Liu
Toward Characterizing 3-D Microwave Field With Microscale Resolution Using Nitrogen-Vacancy Centers in Diamond.
IEEE Trans. Instrum. Meas.
72 (2023)
Tao Pei
,
Fan Cheng
,
Xu Dong Jia
,
Zhong Hao Li
,
Hao Guo
,
Huan Fei Wen
,
Yan Jun Li
,
Jun Tang
,
Jun Liu
High-Resolution Detection of Microwave Fields on Chip Surfaces Based on Scanning Microwave Microscopy.
IEEE Trans. Instrum. Meas.
72 (2023)