Haifeng Gu

Publication Activity (10 Years)

Years Active: 2018-2023
Publications (10 Years): 10

Top Topics

Protocol Specification

Object Tracking

Greenhouse Gases

Top Venues

IEEE Trans. Sustain. Comput.

IEEE Trans. Reliab.

Publications

Changyou Wang, Yiwen Xu, Haifeng Gu, Zhaohe Luo, Zhuhua Luo
blooms in Chinese waters under climate change. Ecol. Informatics 75 (2023)
Zhongqi Luan, Lina Wang, Yanjun Wang, Haifeng Gu, Yaxiang Bai
Online and Offline Analysis of Planck Constant Measurement. CECNet (2022)
Haifeng Gu, Jianning Zhang, Mingsong Chen, Tongquan Wei, Li Lei, Fei Xie
Specification-Driven Conformance Checking for Virtual/Silicon Devices Using Mutation Testing. IEEE Trans. Computers 70 (3) (2021)
Haifeng Gu, Zishuai Ge, E. Cao, Mingsong Chen, Tongquan Wei, Xin Fu, Shiyan Hu
A Collaborative and Sustainable Edge-Cloud Architecture for Object Tracking with Convolutional Siamese Networks. IEEE Trans. Sustain. Comput. 6 (1) (2021)
Yingying Zhang, Feng Xiong, Yi Xie, Xuan Fan, Haifeng Gu
The Impact of Artificial Intelligence and Blockchain on the Accounting Profession. IEEE Access 8 (2020)
Haifeng Gu, Jianning Zhang, Tian Liu, Ming Hu, Junlong Zhou, Tongquan Wei, Mingsong Chen
DIAVA: A Traffic-Based Framework for Detection of SQL Injection Attacks and Vulnerability Analysis of Leaked Data. IEEE Trans. Reliab. 69 (1) (2020)
Haifeng Gu, Mingsong Chen, Yanzhao Wang, Fei Xie
SpectreCheck: An Approach to Detecting Speculative Execution Side Channels in Data Cache. ICESS (2020)
Mingsong Chen, Xinqian Zhang, Haifeng Gu, Tongquan Wei, Qi Zhu
Sustainability-Oriented Evaluation and Optimization for MPSoC Task Allocation and Scheduling under Thermal and Energy Variations. IEEE Trans. Sustain. Comput. 3 (2) (2018)
Tingming Wu, Haifeng Gu, Junlong Zhou, Tongquan Wei, Xiao Liu, Mingsong Chen
Soft error-aware energy-efficient task scheduling for workflow applications in DVFS-enabled cloud. J. Syst. Archit. 84 (2018)
Haifeng Gu, Mingsong Chen, Tongquan Wei, Li Lei, Fei Xie
Specification-driven automated conformance checking for virtual prototype and post-silicon designs. DAC (2018)