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Götz T. Gresser
ORCID
Publication Activity (10 Years)
Years Active: 2020-2024
Publications (10 Years): 6
Top Topics
Evolvable Hardware
Biological Inspired
Design Requirements
Evaluation Method
Top Venues
J. Comput. Des. Eng.
Sensors
Comput. Aided Des.
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Publications
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Fabian Kannenberg
,
Christoph Zechmeister
,
Marta Gil pérez
,
Yanan Guo
,
Xiliu Yang
,
David Forster
,
Sebastian Hügle
,
Pascal Mindermann
,
Moataz Abdelaal
,
Laura Balangé
,
Volker Schwieger
,
Daniel Weiskopf
,
Götz T. Gresser
,
Peter Middendorf
,
Manfred Bischoff
,
Jan Knippers
,
Achim Menges
Toward reciprocal feedback between computational design, engineering, and fabrication to co-design coreless filament-wound structures.
J. Comput. Des. Eng.
11 (3) (2024)
Marta Gil pérez
,
Pascal Mindermann
,
Christoph Zechmeister
,
David Forster
,
Yanan Guo
,
Sebastian Hügle
,
Fabian Kannenberg
,
Laura Balangé
,
Volker Schwieger
,
Peter Middendorf
,
Manfred Bischoff
,
Achim Menges
,
Götz T. Gresser
,
Jan Knippers
Data processing, analysis, and evaluation methods for co-design of coreless filament-wound building systems.
J. Comput. Des. Eng.
10 (4) (2023)
Marta Gil pérez
,
Christoph Zechmeister
,
Fabian Kannenberg
,
Pascal Mindermann
,
Laura Balangé
,
Yanan Guo
,
Sebastian Hügle
,
Andreas Gienger
,
David Forster
,
Manfred Bischoff
,
Cristina Tarín
,
Peter Middendorf
,
Volker Schwieger
,
Götz T. Gresser
,
Achim Menges
,
Jan Knippers
Computational co-design framework for coreless wound fibre-polymer composite structures.
J. Comput. Des. Eng.
9 (2) (2022)
Sebastian Micus
,
Michael Haupt
,
Götz T. Gresser
Automatic Joining of Electrical Components to Smart Textiles by Ultrasonic Soldering.
Sensors
21 (2) (2021)
Axel Körner
,
Larissa Born
,
Oliver Bucklin
,
Seiichi Suzuki
,
Lauren Vasey
,
Götz T. Gresser
,
Achim Menges
,
Jan Knippers
Integrative design and fabrication methodology for bio-inspired folding mechanisms for architectural applications.
Comput. Aided Des.
133 (2021)
Sebastian Micus
,
Ivan Kirsten
,
Michael Haupt
,
Götz T. Gresser
Analysis of Hot Bar Soldering, Insulation Displacement Connections (IDC), and Anisotropic Conductive Adhesives (ACA), for the Automated Production of Smart Textiles.
Sensors
20 (1) (2020)