Frank E. Bosco

Publication Activity (10 Years)

Years Active: 2002-2015
Publications (10 Years): 0

Top Topics

Ibm Zenterprise

Multichip Module

Top Venues

IBM J. Res. Dev.

Publications

John G. Torok, Frank E. Bosco, Gary F. Goth, John J. Loparco, M. T. Peets, Donald W. Porter, S. G. Shevach, B. C. Tucker, A. C. VanDeventer, X. Wei, P. A. Wendling, Y. Yu, R. J. Zoodsma
Mechanical packaging, power, and cooling design for the IBM z13. IBM J. Res. Dev. 59 (4/5) (2015)
Thomas Strach, Frank E. Bosco, Kenneth L. Christian, Kevin R. Covi, Martin Eckert, Gregory R. Edlund, Roland Frech, Hubert Harrer, Andreas Huber, Dierk Kaller, Martin Kindscher, A. Z. Muszynski, G. A. Peterson, Claudio Siviero, Jochen Supper, Otto A. Torreiter, Thomas-Michael Winkel
Electronic packaging of the IBM System z196 enterprise-class server processor cage. IBM J. Res. Dev. 56 (1) (2012)
Thomas A. Gregg, David Craddock, Daniel J. Stigliani, Frank E. Bosco, E. E. Cruz, Michael F. Scanlon, Philip A. Sciuto, G. Bayer, M. Jung, Christoph Raisch
Overview of IBM zEnterprise 196 I/O subsystem with focus on new PCI Express infrastructure. IBM J. Res. Dev. 56 (1) (2012)
M. Andres, Andreas Bieswanger, Frank E. Bosco, Gary F. Goth, H. Hering, William P. Kostenko, Thomas B. Mathias, T. Pohl, H. Wen
IBM zEnterprise energy management. IBM J. Res. Dev. 56 (1) (2012)
John G. Torok, Frank E. Bosco, W. L. Brodsky, E. F. Furey, Gary F. Goth, Daniel J. Kearney, John J. Loparco, M. T. Peets, K. L. Pizzolato, Donald W. Porter, G. Ruehle, W. H. White
Packaging design of the IBM System z10 Enterprise Class platform central electronic complex. IBM J. Res. Dev. 53 (1) (2009)
Juan C. Parrilla, Frank E. Bosco, John S. Corbin, John J. Loparco, Prabjit Singh, John G. Torok
Packaging the IBM eServer z990 central electronic complex. IBM J. Res. Dev. 48 (3-4) (2004)
Prabjit Singh, Steven J. Ahladas, Wiren Dale Becker, Frank E. Bosco, Joseph P. Corrado, Gary F. Goth, Sushumna Iruvanti, Matthew A. Nobile, Budy D. Notohardjono, John H. Quick, Edward J. Seminaro, Kwok M. Soohoo, Chang-yu Wu
A power, packaging, and cooling overview of the IBM eServer z900. IBM J. Res. Dev. 46 (6) (2002)