Arvind Sridhar

Publication Activity (10 Years)

Years Active: 2009-2020
Publications (10 Years): 7

Top Topics

Modeling Framework

Power Generation

Heart Rate Variability

Top Venues

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

IEEE Trans. Computers

Publications

Soeren Klingner, Zhiwei Han, Yuanting Liu, Fan Fan, Bashar Altakrouri, Bruno Michel, Jonas R. M. Weiss, Arvind Sridhar, Sophie Mai Chau
Firefighter Virtual Reality Simulation for Personalized Stress Detection. KI (2020)
Ali Oskooei, Sophie Mai Chau, Jonas R. M. Weiss, Arvind Sridhar, María Rodríguez Martínez, Bruno Michel
DeStress: Deep Learning for Unsupervised Identification of Mental Stress in Firefighters from Heart-rate Variability (HRV) Data. CoRR (2019)
Thomas Brunschwiler, Jonas R. M. Weiss, Stephan Paredes, Arvind Sridhar, Ulrike Pluntke, Sophie Mai Chau, Sebastian Gerke, Jorge Barroso, Emanuel Loertscher, Yuksel Temiz, Patrick W. Ruch, Bruno Michel, Sufi Zafar, Theodore G. van Kessel
Internet of the Body - Wearable Monitoring and Coaching. GIoTS (2019)
Ulrike Pluntke, Sebastian Gerke, Arvind Sridhar, Jonas R. M. Weiss, Bruno Michel
Evaluation and Classification of Physical and Psychological Stress in Firefighters using Heart Rate Variability. EMBC (2019)
Artem Aleksandrovich Andreev, Arvind Sridhar, Mohamed M. Sabry, Marina Zapater, Patrick W. Ruch, Bruno Michel, David Atienza
PowerCool: Simulation of Cooling and Powering of 3D MPSoCs with Integrated Flow Cell Arrays. IEEE Trans. Computers 67 (1) (2018)
Rahel Strässle, Sebastian Gerke, Thomas Brunschwiler, Yuksel Temiz, Jonas R. M. Weiss, Arvind Sridhar, Stephan Paredes, Emanuel Loertscher, Neil Ebejer, Bruno Michel, H.-M. Lee, C. Alvarado, Ismael Faro, T. van Kessel, Mounir Meghelli, Marc A. Taubenblatt, Sufi Zafar, Frank Libsch, Keiji Matsumoto
Internet of the Body and Cognitive Hypervisor. CHASE (2017)
Rahel Straessle, Yuksel Temiz, Sebastian Gerke, Jonas R. M. Weiss, Arvind Sridhar, Stephan Paredes, Thomas Brunschwiler, Emanuel Loertscher, Neil Ebejer, Bruno Michel, T. van Kessel, Ismael Faro, Sufi Zafar, Frank Libsch, Marc A. Taubenblatt, Keiji Matsumoto
Internet of the body and cognitive companion: Enabling high-quality monitoring of patients at home. Healthcom (2017)
Arvind Sridhar, Mohamed M. Sabry, David Atienza
ICCAD 2015 Contest in 3D Interlayer Cooling Optimized Network. ICCAD (2015)
Arvind Sridhar, Alessandro Vincenzi, David Atienza, Thomas Brunschwiler
3D-ICE: A Compact Thermal Model for Early-Stage Design of Liquid-Cooled ICs. IEEE Trans. Computers 63 (10) (2014)
Arvind Sridhar, Mohamed M. Sabry, David Atienza
A Semi-Analytical Thermal Modeling Framework for Liquid-Cooled ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33 (8) (2014)
Mohamed M. Sabry, Arvind Sridhar, David Atienza, Patrick W. Ruch, Bruno Michel
Integrated microfluidic power generation and cooling for bright silicon MPSoCs. DATE (2014)
Arvind Sridhar, Mohamed M. Sabry, Patrick W. Ruch, David Atienza, Bruno Michel
PowerCool: simulation of integrated microfluidic power generation in bright silicon MPSoCs. ICCAD (2014)
Mohamed M. Sabry, Arvind Sridhar, Jie Meng, Ayse K. Coskun, David Atienza
GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32 (4) (2013)
Arvind Sridhar, Yassir Madhour, David Atienza, Thomas Brunschwiler, John Richard Thome
STEAM: a fast compact thermal model for two-phase cooling of integrated circuits. ICCAD (2013)
Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero, David Atienza
Neural Network-Based Thermal Simulation of Integrated Circuits on GPUs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31 (1) (2012)
Alessandro Vincenzi, Arvind Sridhar, Martino Ruggiero, David Atienza
Accelerating thermal simulations of 3D ICs with liquid cooling using neural networks. ACM Great Lakes Symposium on VLSI (2012)
Mohamed M. Sabry, Arvind Sridhar, David Atienza
Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation. DATE (2012)
David Atienza, Arvind Sridhar
Tutorial T7A: New Modeling Methodologies for Thermal Analysis of 3D ICs and Advanced Cooling Technologies of the Future. VLSI Design (2012)
Alessandro Vincenzi, Arvind Sridhar, Martino Ruggiero, David Atienza
Fast thermal simulation of 2D/3D integrated circuits exploiting neural networks and GPUs. ISLPED (2011)
Mohamed M. Sabry, Arvind Sridhar, David Atienza, Yuksel Temiz, Yusuf Leblebici, S. Szczukiewicz, Navid Borhani, John Richard Thome, Thomas Brunschwiler, Bruno Michel
Towards thermally-aware design of 3D MPSoCs with inter-tier cooling. DATE (2011)
Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero, Thomas Brunschwiler, David Atienza
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling. ICCAD (2010)
José L. Ayala, Arvind Sridhar, David Cuesta
Thermal modeling and analysis of 3D multi-processor chips. Integr. 43 (4) (2010)
José L. Ayala, Arvind Sridhar, Vinod Pangracious, David Atienza, Yusuf Leblebici
Through Silicon Via-Based Grid for Thermal Control in 3D Chips. NanoNet (2009)