3DIC

Publications

2023

IEEE International 3D Systems Integration Conference, 3DIC 2023, Cork, Ireland, May 10-12, 2023 3DIC (2023)
Po-Yao Chuang, Francesco Lorenzelli, Sreejit Chakravarty, Slimane Boutobza, Cheng-Wen Wu, Georges G. E. Gielen, Erik Jan Marinissen
Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based Packages. 3DIC (2023)
Pouria Zaghari, Sourish S. Sinha, Jong Eun Ryu, Paul D. Franzon, Douglas C. Hopkins
Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package. 3DIC (2023)
Erik W. Masselink, Andrew Stark, Benjamin B. Yang, T. Robert Harris
Review of Hybrid Integration Techniques for Integrating III-V Onta Silicon. 3DIC (2023)
Koutaro Hachiya
Measurement Point Selection Algorithms for Testing Power TSVs. 3DIC (2023)
Priyank Kashyap, Prasanth Prabu Ravichandiran, Lee Wang, Dror Baron, Chau-Wai Wong, Tianfu Wu, Paul D. Franzon
Thermal Estimation for 3D-ICs Through Generative Networks. 3DIC (2023)
Mohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic
Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. 3DIC (2023)
Emre Can Durmaz, Carl Heine, Zhibo Cao, Jens Lehmann, Dietmar Kissinger, Matthias Wietstruck
SiGe BiCMOS Technology with Embedded Microchannels based on Cu Pillar PCB Integration Enabling sub-THz Microfluidic Sensor Applications. 3DIC (2023)
Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima
Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last. 3DIC (2023)
Somnath Pal, Liang Ye, James O'Callaghan, Fatih Bilge Atar, Cian O'Mathuna, Brian Corbett, Ranajit Sai, Sambuddha Khan
A Study on a Tether-Less Approach Towards Micro-Transfer-Printing of Large-Footprint Power Micro-Inductor Chiplets. 3DIC (2023)
Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima
Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding. 3DIC (2023)
Joshua A. Stevens, Tse-Han Pan, Prasanth Prabu Ravichandiran, Paul D. Franzon
Chiplet Set For Artificial Intelligence. 3DIC (2023)
Nermeen Hossam, John Ferguson
Fast, Accurate Assembly-Level Physical Verification of 3DIC Packages. 3DIC (2023)

2021

2019