HCS

Publications

2023

Jin Hyun Kim, Yuhwan Ro, Jinin So, Sukhan Lee, Shinhaeng Kang, YeonGon Cho, Hyeonsu Kim, Byeongho Kim, Kyungsoo Kim, Sangsoo Park, Jin-Seong Kim, Sanghoon Cha, Won-Jo Lee, Jin Jung, Jong-Geon Lee, Jieun Lee, Joon-Ho Song, Seungwon Lee, Jeonghyeon Cho, Jaehoon Yu, Kyomin Sohn
Samsung PIM/PNM for Transfmer Based AI : Energy Efficiency on PIM/PNM Cluster. HCS (2023)
Zhibin Xiao
: A Deep-Sparse AI Inference System-on-Chip for Vision and Large-language Models. HCS (2023)
Chris Gianos
Architecting for Flexibility and Value with Next Gen Intel® Xeon® Processors. HCS (2023)
Luca Valente, A. Veeran, Mattia Sinigaglia, Yvan Tortorella, Alessandro Nadalini, Nils Wistoff, Bruno Sá, Angelo Garofalo, Rafail Psiakis, M. Tolba, Ari Kulmala, Nimisha Limaye, Ozgur Sinanoglu, Sandro Pinto, Daniele Palossi, Luca Benini, Baker Mohammad, Davide Rossi
Shaheen: An Open, Secure, and Scalable RV64 SoC for Autonomous Nano-UAVs. HCS (2023)
Don Soltis, Stephen Robinson
The Next Generation of High Performance, Energy-Efficient Computing: Intel® Xeon® Processors Built on Efficient-Core. HCS (2023)
Seungjae Moon, Junsoo Kim, Jung-Hoon Kim, Junseo Cha, Gyubin Choi, Seongmin Hong, Joo-Young Kim
) Accelerating Hyperscale Models for Generative AI. HCS (2023)
Guiming Shi, Yi Li, Xueqiang Wang, Zhanhong Tan, Dapeng Cao, Jingwei Cai, Yuchen Wei, Zehua Li, Wuke Zhang, Yifu Wu, Wei Xu, Kaisheng Ma
PHEP: Paillier Homomorphic Encryption Processors for Privacy-Preserving Applications in Cloud Computing. HCS (2023)
Kevin Deierling
NVIDIA's Resource Transmutable Network Processing ASIC. HCS (2023)
Ian Winfield, Joseph Madril, Tim Ouradnik, Michael Matthews, Guillermo Romero
FABRIC8LABS: Electrochemical Additive Manufacturing (ECAM) For Cooling High Performance ICs. HCS (2023)
35th IEEE Hot Chips Symposium, HCS 2023, Palo Alto, CA, USA, August 27-29, 2023 HCS (2023)
Dinesh Gaitonde
AMD Next-Generation FPGA Built from Chiplets. HCS (2023)
Srivi Dhruvanarayan, Victor Bittorf
- An Overview. HCS (2023)
Jeff Dean, Amin Vahdat
Exciting Directions for ML Models and the Implications for Computing Hardware. HCS (2023)
Efraim Rotem
Intel® Energy Efficiency Architecture. HCS (2023)
Anitha Kona
CSS N2: Arm Neoverse N2 Platform, Delivered to Partners as a Fully Verified, Customizable Subsystem. HCS (2023)
Jason Howard
The First Direct Mesh-to-Mesh Photonic Fabric. HCS (2023)
Kai Troester, Ravi Bhargava
AMD Next Generation "Zen 4" Core and 4th Gen AMD EPYC™ 9004 Server CPU. HCS (2023)
Yongkee Kwon, Guhyun Kim, Nahsung Kim, Woojae Shin, Jongsoon Won, Hyunha Joo, Haerang Choi, Byeongju An, Gyeongcheol Shin, Dayeon Yun, Jeongbin Kim, Changhyun Kim, Ilkon Kim, Jaehan Park, Chanwook Park, Yosub Song, Byeongsu Yang, Hyeongdeok Lee, Seungyeong Park, Wonjun Lee, Seongju Lee, Kyuyoung Kim, Daehan Kwon, Chunseok Jeong, John Kim, Euicheol Lim, Junhyun Chun
Memory-Centric Computing with SK Hynix's Domain-Specific Memory. HCS (2023)
Zhanhong Tan, Yifu Wu, Yannian Zhang, Haobing Shi, Wuke Zhang, Kaisheng Ma
A Scalable Multi-Chiplet Deep Learning Accelerator with Hub-Side 2.5D Heterogeneous Integration. HCS (2023)
Bill Dally
Hardware for Deep Learning. HCS (2023)
Dharmendra S. Modha, Filipp Akopyan, Alexander Andreopoulos, Rathinakumar Appuswamy, John V. Arthur, Andrew S. Cassidy, Pallab Datta, Michael V. DeBole, Steven K. Esser, Carlos Ortega Otero, Jun Sawada, Brian Taba, Arnon Amir, Deepika Bablani, Peter J. Carlson, Myron D. Flickner, Rajamohan Gandhasri, Guillaume Garreau, Megumi Ito, Jennifer L. Klamo, Jeffrey A. Kusnitz, Nathaniel J. McClatchey, Jeffrey L. McKinstry, Yutaka Y. Nakamura, Tapan K. Nayak, William P. Risk, Kai Schleupen, Ben Shaw, Jay Sivagnaname, Daniel F. Smith, Ignacio Terrizzano, Takanori Ueda
IBM NorthPole Neural Inference Machine. HCS (2023)
Felicia Guo, Nayiri Krzysztofowicz, Alex Moreno, Jeffrey Ni, Daniel Lovell, Yufeng Chi, Kareem Ahmad, Sherwin Afshar, Josh Alexander, Dylan Brater, Cheng Cao, Daniel Fan, Ryan Lund, Jackson Paddock, Griffin Prechter, Troy Sheldon, Shreesha Sreedhara, Anson Tsai, Eric Wu, Kerry Yu, Daniel Fritchman, Aviral Pandey, Ali Niknejad, Kristofer S. J. Pister, Borivoje Nikolic
A Heterogeneous SoC for Bluetooth LE in 28nm. HCS (2023)
Mahesh Subramon, David Kramer, Indrani Paul
7040 Series: Technology Overview. HCS (2023)
Eric Mahurin
Qualocmm® Hexagon™ NPU. HCS (2023)
Sean Lie
Inside the Cerebras Wafer-Scale Cluster: Cerebras Systems. HCS (2023)
Magnus Bruce
Arm Neoverse V2 platform: Leadership Performance and Power Efficiency for Next-Generation Cloud Computing, ML and HPC Workloads. HCS (2023)
Lawrence Spracklen, Subutai Ahmad
Supercharged AI Inference on Modern CPUs. HCS (2023)
Mark Wade, Chen Sun, Matthew Sysak, Vladimir Stojanovic, Pooya Tadayon, Ravi Mahajan, Babak Sabi
Driving Compute Scale-out Performance with Optical I/O Chiplets in Advanced System-in-Package Platforms. HCS (2023)
Norman P. Jouppi, Andy Swing
A Machine Learning Supercomputer with an Optically Reconfigurable Interconnect and Embeddings Support. HCS (2023)
Maurice Steinman
Hummingbird™ Low-Latency Computing Engine. HCS (2023)
Ben Esposito
Intel Agilex® 9 Direct RF-Series FPGAs with Integrated 64 Gsps Data Converters. HCS (2023)

2022