Adhesion strength of die attach film for thin electronic package at elevated temperature.

Bruno R. Mose In-Seo Son Dong-Kil Shin

Published in: Microelectron. Reliab. (2018)

Keyphrases

permalloy films
film thickness
rf sputtering
real time
temperature control
software package
high temperature
data sets
neural network
magnetic field
control unit
film restoration
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