MULTICHIP MODULE
Experts
- Lars Brusberg
- Aramais R. Zakharian
- Ming Liu
- Henning Schroder
- Hai P. Longworth
- Hung-Ming Chen
- Ren-Jie Lee
- John U. Knickerbocker
- James N. Humenik
- Christian Herbst
- Alan F. Evans
- Qian Yang
- Martin Kindscher
- John F. McDonald
- Yong Wang
- Zsolt Tokei
- K. S. Venkatraman
- Zhen Wang
- Benedikt M. Kellner
- Sen Wang
- Qiu-lin Tan
- Chad C. Terwilliger
- Mingyu Wang
- L. Wynn Herron
- Dierk Kaller
- Rachid Taibi
- Takashi Takemoto
- K. V. V. Murthy
- Shoichi Tanifuji
- Masanao Yamaoka
- Wenxuan Wu
- Takayasu Sakurai
- Christopher W. Cline
- Paul Villarrubia
- Akifumi Kasamatsu
- Hubert Harrer
- Anand Haridass
- Laurent-Luc Chapelon
- Junbo Wang
Venues
- IBM J. Res. Dev.
- Computer
- IEICE Electron. Express
- ICCD
- Microelectron. Reliab.
- Hot Chips Symposium
- 3DIC
- ECOC
- ISSCC
- IEEE Micro
- IEEE Trans. Very Large Scale Integr. Syst.
- OFC
- COMPCON
- Trans. High Perform. Embed. Archit. Compil.
- ICPP
- IEEE Des. Test Comput.
- PRDC
- ISPD
- A-SSCC
- ICECS
- WCNC Workshops
- Sensors
- PARLE
- IEEE J. Solid State Circuits
- MBMV
- Proc. IEEE
- VLSI Design
- Int. J. Circuit Theory Appl.
- ASAP
- OECC/PSC
- IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
- Bell Syst. Tech. J.
- IEICE Trans. Electron.
- AHFE (2)
- Adv. Comput.
- Microelectron. J.
- ISCAS
- EURO-DAC
- ISLPED
Related Topics
Related Keywords
Popularity
No popularities found. Try to change the filters.
Popularity Trend