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Basic Properties of Fixed Abrasive Polishing by Alumina Abrasive Grain for Si Wafer - Effects of Actual Contact Area and Grain Size -.
Ryunosuke Sato
Published in:
Int. J. Autom. Technol. (2014)
Keyphrases
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grain size
desirable properties
spatial distribution
semiconductor manufacturing
data structure
structural properties
data sets
information systems
decision trees
three dimensional
bayesian networks
expert systems
integrated circuit
thin film
positive effects