Leak-Proof Packaging for GaN Chip with Controlled Thermal Spreading and Transients.

Yasuo Saito Tatsuhiko Aizawa Kenji Wasa Yoshiro Nogami

Published in: BCICTS (2018)

Keyphrases

high density
high speed
infrared
low power
low cost
analog vlsi
private information
multi channel
theorem prover
audio signals
power plant
information flow
neural network
structuring elements
single chip
focal plane
data center
privacy preserving
visible spectrum
design process
complete axiomatization