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Test structure assembly for bump bond yield measurement on high density flip chip technologies.

Miguel UllánManuel LozanoMokhtar ChmeissaniG. BlanchotEnric CabrujaJ. GarcíaM. MaiorinoRicardo MartínezGiulio PellegriniCarles Puigdengoles
Published in: Microelectron. Reliab. (2006)
Keyphrases
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