Best engineering practice for thermal characterization of stacked dice FPGA devices.
Arun RaghupathyHoa DoBrian PhilofskyGamal Refai-AhmedPublished in: 3DIC (2015)
Keyphrases
- field programmable gate array
- low cost
- high speed
- infrared
- reconfigurable hardware
- mobile devices
- embedded systems
- software engineering
- low power consumption
- engineering design
- artificial intelligence
- hardware implementation
- real world
- real time image processing
- fpga device
- digital signal
- industrial design
- data sets
- verilog hdl
- mechanical engineering
- engineering problems
- single chip
- hardware design
- user interface
- neural network