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Brian Philofsky
Publication Activity (10 Years)
Years Active: 2015-2015
Publications (10 Years): 0
Top Topics
Infrared
Fpga Device
Lower Level
Industrial Design
Top Venues
3DIC
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Publications
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Gamal Refai-Ahmed
,
Ivor Barber
,
Anthony Torza
,
Brian Philofsky
A holistic view of chip-level thermal architecture from heterogeneous stacked dice to system level in telecoms applications.
3DIC
(2015)
Arun Raghupathy
,
Hoa Do
,
Brian Philofsky
,
Gamal Refai-Ahmed
Best engineering practice for thermal characterization of stacked dice FPGA devices.
3DIC
(2015)