Sign in

A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors.

Raviteja P. ReddyAmit AcharyyaS. Saqib Khursheed
Published in: ITC-Asia (2019)
Keyphrases
  • probabilistic model
  • theoretical framework
  • artificial intelligence
  • database systems
  • search algorithm
  • conceptual framework