Board level drop test and simulation of leaded and lead-free BGA-PCB assembly.

Xin Qu Zhaoyi Chen Bo Qi Taekoo Lee Jiaji Wang

Published in: Microelectron. Reliab. (2007)

Keyphrases

assembly process
printed circuit boards
stress response
higher level
simulation models
simulation model
databases
test cases
mathematical model
real time
artificial intelligence
wireless sensor networks
simulation environment