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Variation of thermal stress in TSV structures caused by crystallinity of electroplated copper interconnections.

Jiatong LiuKen SuzukiHideo Miura
Published in: 3DIC (2015)
Keyphrases
  • infrared
  • complex structures
  • databases
  • machine learning
  • decision making
  • case study
  • expert systems
  • power plant
  • high density
  • printed circuit boards
  • finite element analysis
  • visible spectrum
  • thermal conductivity