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Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints.

Periannan ArulvananZhaowei ZhongXunqing Shi
Published in: Microelectron. Reliab. (2006)
Keyphrases
  • failure modes
  • database
  • databases
  • case study
  • data model
  • sufficient conditions
  • temporal evolution
  • process model
  • process control