Die Stacking Technology for Terabit Chip-to-Chip Communications.
Arifur RahmanJohn TrezzaBernard J. NewStephen TrimbergerPublished in: CICC (2006)
Keyphrases
- high speed
- low cost
- analog vlsi
- case study
- nm technology
- physical design
- single chip
- cmos technology
- circuit design
- low power
- vlsi implementation
- data processing
- communication technologies
- memory subsystem
- high density
- chip design
- ibm zenterprise
- cmos image sensor
- evolvable hardware
- random access memory
- ibm power processor
- e learning