3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects.

Stuart Daudlin Anthony Rizzo Nathan C. Abrams Sunwoo Lee Devesh Khilwani Vaishnavi Murthy James Robinson Terence Collier Alyosha C. Molnar Keren Bergman

Published in: OFC (2021)

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