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Susceptibility Evaluation of 3D Integrated Static Random Access Memory with Through-Silicon Vias (TSVs).

Xue-Bing CaoLi-Yi XiaoRong-Sheng ZhangJia-Qiang LiHong-Chen LiJin-Xiang Wang
Published in: ICICDT (2019)
Keyphrases
  • random access memory
  • high density
  • high speed
  • data structure