Susceptibility Evaluation of 3D Integrated Static Random Access Memory with Through-Silicon Vias (TSVs).

Xue-Bing Cao Li-Yi Xiao Rong-Sheng Zhang Jia-Qiang Li Hong-Chen Li Jin-Xiang Wang

Published in: ICICDT (2019)

Keyphrases

random access memory

high density

high speed

data structure