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Susceptibility Evaluation of 3D Integrated Static Random Access Memory with Through-Silicon Vias (TSVs).
Xue-Bing Cao
Li-Yi Xiao
Rong-Sheng Zhang
Jia-Qiang Li
Hong-Chen Li
Jin-Xiang Wang
Published in:
ICICDT (2019)
Keyphrases
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random access memory
high density
high speed
data structure