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A three-scale approach to the numerical simulation of metallic bonding for MEMS packaging.
Aldo Ghisi
Stefano Mariani
Alberto Corigliano
Giorgio Allegato
Laura Oggioni
Published in:
Microelectron. Reliab. (2014)
Keyphrases
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numerical simulations
theoretical analysis
scale space
lattice boltzmann
high density
simulation data
temperature field
high speed
finite element method
numerical calculation
computer vision
fluid dynamics
neural network controller
data management
design process
finite element model