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Wafer level packaging of a tape flip-chip chip scale packages.
Greg Hotchkiss
Gonzalo Amador
Darvin Edwards
Paul Hundt
Les Stark
Roger Stierman
Gail Heinen
Published in:
Microelectron. Reliab. (2001)
Keyphrases
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high speed
high density
low cost
analog vlsi
low power
magnetic tape
single chip
programmable logic
real time
vlsi implementation
printed circuit boards
host computer
evolvable hardware
physical design
software packages
data center
evolutionary algorithm
learning algorithm