Signal integrity and EMC performance enhancement using 3D integrated circuits - A case study.
Etienne SicardJianfei WuJiancheng LiPublished in: EMC Compo (2013)
Keyphrases
- integrated circuit
- signal processing
- image processing
- case study
- image enhancement
- test bed
- electron beam
- frequency domain
- non stationary
- printed circuit boards
- high frequency
- compressive sensing
- signal detection
- integrity checking
- hardware description language
- original signal
- wavelet analysis
- measured data
- contrast enhancement
- computer systems