Chemical flip-chip bonding method for fabricating 10-µm-pad-pitch interconnect.
Yasuhiro YamajiTokihiko YokoshimaKatsuya KikuchiHiroshi NakagawaMasahiro AoyagiPublished in: IEICE Electron. Express (2008)
Keyphrases
- high precision
- experimental evaluation
- high accuracy
- detection method
- cost function
- dynamic programming
- optimization algorithm
- high speed
- support vector machine
- fully automatic
- segmentation method
- clustering method
- low cost
- data sets
- computational cost
- significant improvement
- pairwise
- preprocessing
- computational complexity