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The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints.
Yu Tian
Jing Han
Limin Ma
Fu Guo
Published in:
Microelectron. Reliab. (2018)
Keyphrases
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electron microscopy
position and orientation
neural network
real world
database
genetic algorithm
artificial intelligence
decision trees
viewpoint
cross section
behavior recognition
rotationally symmetric