• search
    search
  • reviewers
    reviewers
  • feeds
    feeds
  • assignments
    assignments
  • settings
  • logout

The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints.

Yu TianJing HanLimin MaFu Guo
Published in: Microelectron. Reliab. (2018)
Keyphrases
  • electron microscopy
  • position and orientation
  • neural network
  • real world
  • database
  • genetic algorithm
  • artificial intelligence
  • decision trees
  • viewpoint
  • cross section
  • behavior recognition
  • rotationally symmetric