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A review of wafer bonding materials and characterizations to enable wafer thinning, backside processing, and laser dicing.

G. WilliamsPatrick O'HaraJ. MooreBart GordonJ. Rose
Published in: 3DIC (2009)
Keyphrases
  • integrated circuit
  • semiconductor manufacturing
  • massively parallel
  • real time
  • data processing
  • information processing
  • real world
  • preprocessing
  • thinning algorithm