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Bart Gordon
Publication Activity (10 Years)
Years Active: 2009-2009
Publications (10 Years): 0
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Publications
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G. Williams
,
Patrick O'Hara
,
J. Moore
,
Bart Gordon
,
J. Rose
A review of wafer bonding materials and characterizations to enable wafer thinning, backside processing, and laser dicing.
3DIC
(2009)