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High-Q Timing and Inertial Measurement Unit Chip (TIMU) with 3D Wafer-Level Packaging.

Farrokh AyaziHaoran WenYaesuk JeongPranav GuptaAnosh DaruwallaChang-Shun Liu
Published in: CICC (2019)
Keyphrases
  • high speed
  • high density
  • low cost
  • inertial measurement unit
  • three dimensional