Structural and Device Considerations for Vertical Cross Point Memory with Single-stack Memory toward CXL Memory beyond 1x nm 3DXP.
Sijung YooDonghoon KimYoon Mo KooSujee Kim Wooju JeongHyungjoon ShimWon-Jun LeeBeom Seok LeeSeungyun LeeHyejung ChoiHyung Dong LeeTaehoon KimMyung-Hee NaPublished in: IMW (2022)