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Structural and Device Considerations for Vertical Cross Point Memory with Single-stack Memory toward CXL Memory beyond 1x nm 3DXP.

Sijung YooDonghoon KimYoon Mo KooSujee Kim Wooju JeongHyungjoon ShimWon-Jun LeeBeom Seok LeeSeungyun LeeHyejung ChoiHyung Dong LeeTaehoon KimMyung-Hee Na
Published in: IMW (2022)
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