Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write 3D-Printed Interconnects.

Jacob Dawes Tzu-Hsuan Chou Matthew L. Johnston

Published in: BioCAS (2023)

Keyphrases

high speed
low cost
integrated circuit
input output
power consumption
database
high density
case study
low power
lower level
levels of abstraction
lower cost
cmos technology
semiconductor manufacturing