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Effects Of Wafer Bonding And Thinning Processes On Electrical Performance Of Mos Devices.

Wenjiang ZengHuamao LinXiaolin ZhangRamasamy ChockalingamWee Chong HengSangki HongNarayanan Balasubramanian
Published in: Int. J. Comput. Eng. Sci. (2003)
Keyphrases
  • mobile devices
  • preprocessing
  • massively parallel
  • semiconductor manufacturing
  • artificial neural networks
  • edge detection
  • process model
  • transmission line
  • power grid
  • information systems
  • floating gate