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Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish.
Hsiu-Jen Lin
Tung-Han Chuang
Published in:
Microelectron. Reliab. (2011)
Keyphrases
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mechanical properties
electron microscopy
x ray
finite element model
three dimensional
virtual reality
genetic algorithm
image processing
image segmentation
face recognition
multiscale
video sequences
augmented reality
thin film