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Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging.

Xiaowu HuYulong LiYong LiuYi LiuZhixian Min
Published in: Microelectron. Reliab. (2014)
Keyphrases
  • mechanical properties
  • composite materials
  • shear stress
  • age estimation
  • mathematical model
  • software aging
  • computer vision
  • finite element model
  • electron microscopy
  • age related
  • wet lab