A multi-chip-architecture based flexible stimulation device for retinal prosthesis with a flip-chip packaging technique.
Takashi TokudaMasayuki KawadaSachie SugitaniMari TaniyamaAkihiro UeharaKeiichiro KagawaMasahiro NunoshitaJun OhtaPublished in: EMBC (2006)
Keyphrases
- high density
- high speed
- analog vlsi
- vlsi implementation
- low cost
- modular design
- host computer
- programmable logic
- management system
- cmos image sensor
- cmos technology
- single chip
- physical design
- real time
- level parallelism
- evolvable hardware
- multithreading
- circuit design
- field effect transistors
- memory access
- network on chip
- nm technology
- digital signal processors
- floating point arithmetic