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200 mm Wafer level graphene transfer by wafer bonding technique.
Mesut Inac
Grzegorz Lupina
Matthias Wietstruck
Marco Lisker
Mirko Fraschke
Andreas Mai
Fabio Coccetti
Mehmet Kaynak
Published in:
ESSDERC (2017)
Keyphrases
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semiconductor manufacturing
integrated circuit
massively parallel
higher level
neural network
levels of abstraction
individual level
search algorithm
computer vision
transfer learning
manufacturing systems
lower level