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MEMS wafer-level vacuum packaging with transverse interconnects for CMOS integration.

Dominique LemoinePaul-Vahe CicekFrederic NabkiMourad N. El-Gamal
Published in: CICC (2008)
Keyphrases
  • high speed
  • higher level
  • power consumption
  • databases
  • information retrieval
  • data integration
  • input output
  • design process
  • integrated circuit
  • high density
  • levels of abstraction