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Thermal Deformation Suppression Chip Based on Material Symmetry Design for Single Center Supported MEMS Devices.
Bowen Xing
Bin Zhou
Xinxi Zhang
Wenming Zhang
Bo Hou
Qi Wei
Tian Zhang
Rong Zhang
Published in:
IEEE Access (2020)
Keyphrases
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single chip
design methodology
neural network
real time
low power consumption
modular design
infrared
circuit design
mixed signal
vlsi implementation
physical design
computer aided
design process
high speed
edge detection
mobile devices
case study
e learning