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High-Performance RF Power Amplifier Module Using Optimum Chip-Level Packaging Structure.

Hyosung NamJihoon KimJooyoung JeonHeesauk JhonJunghyun Kim
Published in: IEEE Trans. Ind. Electron. (2022)
Keyphrases
  • high density
  • high power
  • high speed
  • low cost
  • power consumption
  • structural information
  • chip design
  • signal processing
  • low power consumption
  • signal processor