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High-Performance RF Power Amplifier Module Using Optimum Chip-Level Packaging Structure.
Hyosung Nam
Jihoon Kim
Jooyoung Jeon
Heesauk Jhon
Junghyun Kim
Published in:
IEEE Trans. Ind. Electron. (2022)
Keyphrases
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high density
high power
high speed
low cost
power consumption
structural information
chip design
signal processing
low power consumption
signal processor