Comparing Through-Silicon-Via (TSV) Void/Pinhole Defect Self-Test Methods.

Yi Lou Zhuo Yan Fan Zhang Paul D. Franzon

Published in: J. Electron. Test. (2012)

Keyphrases

real time
preprocessing
benchmark datasets
information systems
significant improvement
computational cost
machine learning methods
data sets
neural network
artificial intelligence
feature selection
low cost
statistical methods