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Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments.
Jonas Johansson
Ilja Belov
Erland Johnson
Rainer Dudek
Peter Leisner
Published in:
Microelectron. Reliab. (2014)
Keyphrases
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thermal imaging
high temperature
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heat transfer
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varying degrees