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A 6.4-Gbps 0.41-pJ/b fully-digital die-to-die interconnect PHY for silicon interposer based 2.5D integration.

Yinglin YangYunzhengmao WangTengyue YiChixiao ChenQi Liu
Published in: Integr. (2024)
Keyphrases
  • high speed
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  • information integration
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  • three dimensional
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  • digital objects